HITIONS partner with pineapple manufacturing platform, focusing on pcb / pcba prototypes layout, smt patch processing, stencil making and other manufacturing services, has an efficient production team for more than ten years and provides professional pcb solutions for enterprises.
- Simple board, mid-to-high-end board can be made, no need to manage multiple suppliers.
2. Proofing and batching can be done, and the process is uniform.
3. FPC board, HDI board, ceramic substrate, and rigid-flex board can be made.
4. Use LDI process to waive film fees!
Following are our PCB sample prototyping ability:
|Layers||1-14layers||Number of layers, refers to the number of layers of the design file, usually produce 1-6 layers of through-hole plates|
|Ink||Sun series||White oil: Sun 2000 series, green oil: Sun 07 series|
|Plate type||CEM-1/FR-4/Aluminum plate||CEM-1 plate（JIANTAO-KB5150）FR-4 plate（SHENGYI-S1141)Aluminum plate (GUOJI-GL11)|
|Max size||650x520mm/640x480mm||Max single-sided size为650x520mm, Max size of four or six layers is 640x480mm|
|Dimensional accuracy||±0.15mm||CNC outline tolerance ± 0.15mm, V-cut board outline tolerance ± 1.5mm|
|Plate thickness||0.4–2.0mm||Common thickness 0.4/0.6/0.8/1.0/1.2/1.6/2.0 mm|
|Plate thickness tolerance ( t≥1.0mm)||± 10%||Attention:Due to production process reasons (sinking copper, solder mask, pad spraying will increase board thickness), generally the tolerance is positive.|
|Plate thickness tolerance( t<1.0mm)||±0.1mm||Attention:Due to production process reasons (sinking copper, solder mask, pad spraying will increase board thickness), generally the tolerance is negative.|
|Minimum line width||4mil（0.1mm）||Minimum line width maybe larger than 4mil|
|Minimum clearance||4mil（0.1mm）||Minimum clearance maybe larger than 4mil|
|Outer layer copper thickness||35um/70um（1 OZ/2 OZ）||Refers to the thickness of the copper foil on the outer layer of the finished circuit board，1 OZ＝35um，2 OZ=70um|
|Inner layer copper thickness||35um||Inner layers all made from 1 OZ|
|Drilling hole diameter (machine drill)||0.25–6.3mm||0.25mm is the minimum hole diameter for drilling and 6.3mm is the maximum hole diameter for drilling.|
|Via single-sided welding ring||≥0.153mm（6mil）||If the single-sided welding ring of the conductive hole or the plug-in hole is too small, but there is enough space there, the size of the single side of the welding ring is not limited; if there is not enough space there and there are dense traces, the smallest single side Welding ring must not be less than 0.153mm|
|Finished hole diameter (machine drill)||0.25–6.5mm||Because the inner wall of the hole is metal copper, the hole diameter of the finished hole is generally smaller than the hole diameter|
|Hole tolerance (machine drill)||±0.075mm||The tolerance of drilling is ± 0.075mm. For example, if the hole is designed as 0.6mm, the finished hole diameter of the physical board is acceptable in the range of 0.525–0.675mm.|
|Solder mask type||Photosensitive ink||Photosensitive ink is the most used type now, thermosetting oil is generally used in low-grade single-sided cardboard|
|Minimum character width||≥0.15mm||The minimum width of characters, if it is less than 0.15mm, the physical board may cause the characters to be unclear due to design reasons|
|Minimum character height||≥0.8mm||The minimum height of the characters, if it is less than 0.8mm, the physical board may cause the characters to be unclear due to design reasons|
|Character aspect ratio||1:5||The most suitable aspect ratio is more conducive to production|
|Trace and outline spacing||≥0.3mm（12mil）||Gong board shipment, the distance between the line layer and the board outline is not less than 0.3mm; V-cut puzzle board shipment, the distance from the V-cut center line must not be less than 0.4mm|
|Imposition: no gap imposition gap||0||The gap between the middle plate and the plate is 0|
|Imposition: with gaps||1.6mm||The gap of the gap imposition should not be less than 1.6mm, otherwise it will be more difficult when gong edge.|
|Pads manufacturers copper laying method||Hatch way copper||Attention: The manufacturer uses copper reduction.|
|Picture slot in Pads software||Use the Drill Drawing layer||If there are many non-metallized grooves on the board, please draw on the Drill Drawing layer|
|Window layer in Protel / dxp software||Solder layer||A few engineers mistakenly put in the paste layer, and do not deal with the paste layer.|
|Protel/dxp outer layers||Keep-out layer or mechanical-layer||Please note: Only one shape layer is allowed in a file, and two shape layers are not allowed to exist at the same time. Please delete unused shape layers, that is, you can only choose one of Keepout layer or mechanical layer when drawing the shape|
|Half hole process||Minimum half-hole diameter 1.0mm||The half-hole process is a special process, and the minimum hole diameter must not be less than 1.0mm|
|Solder mask||0.1mm||Please not in advance if there is a solder bridge requirement, as cost for solder bridge will increase.|